BMD50 Diode pump laser scribing machine

Equipment performance

This machine adopts the diode pump laser, it has the characters of higher integrative degree, better quality of laser beam, lower running cost and little maintenance during long time. Imported key spare parts, simple structure for whole machine, fast scribing speed and higher precision, it can work continuously over 24 hours.

Applicable fields

Scribing & Cutting for the mono-crystalline sillicon, poly-crystalline sillicon, amorphous-crystalline sillicon, solar cell, wafer in solar industry.

Cutting for the mono-crystalline sillicon and poly-crystalline sillicon in electronic industry.

Technology Parameter

Type specification  ..................Diode pump laser 50W

Laser wavelength ....................1064nm

Scriber precision......................≤±10μm

Max scriber thickness..............1.2mm

Scriber line width......................≤30μm

Laser repetition frequency...........200Hz~50kHz

Max scriber speed.. ..................140mm/s

Laser max power .....................≥50W

Work platform size...................350×350mm

Power supply...........................220V/ 50Hz /2kVA

Cooling system ........................Water cooling system

Work platform...........................The adsorption of vacuum pump on two dimension     programmed moving platform.